Facilities
- Services offered by PCB Fabrication
- Services offered by Photonic Devices Cluster
- Services offered by Engineering Design Lab
- Services offered by EMC and Lightning Protection & Power Quality Cluster
- Services offered by RF Test & Applications Cluster
PCB Fabrication
TMR&D Engineering Design (PCB Fabrication Department) consist of highly skilled full time Design & Fabrication to build and develop prototype and special projects.
Our fully equipped facilities and highly trained, experienced staff can fabricate PCB from your drawings, PCB samples or GERBER data.
| Item | Capabilities |
| Single Sided | Design & Fabricate Prototype |
| ....................................................................................................................................................................................................... | |
| Double Sided | Design & Fabricate Prototype |
| ....................................................................................................................................................................................................... | |
| Surface Finishing | Solder Flux coated (Clear gloss)
Mechanical miling surface Chemical etching surface |
| ....................................................................................................................................................................................................... | |
| PCB Specification | Min Track Width = 0.1mm (4mil)
Min gap = 0.1mm (4mil) Min hole diameter = 0.2mm (8mil) Resolution = 1 micron Drilling hole = 90 holes/min Plated-Through-Hole Max Working area = A3 PCB Size |
| ....................................................................................................................................................................................................... | |
| Fabrication equipment | |||
| Type | Model | Manufacturer | Functions |
| CNC Drill / Router | ProtoMat H60 | LPKF, Germany | |
| ....................................................................................................................................................................................................... | |||
| Circuit Plotter | ProtoMat H60 | LPKF, Germany | Perform drilling, routing and mechanical milling. |
| ....................................................................................................................................................................................................... | |||
| Multilayer Press | MultiPress II | LPKF, Germany | Fabricate Prototype (4-6 Layers 2nd Qtr 2006 |
| ....................................................................................................................................................................................................... | |||
| Spray Etcher | Splash Center | Bungard, Germany | Perform chemical etching on PCB after UV Exposure process |
| ....................................................................................................................................................................................................... | |||
| Ultra Violet (UV) exposure | Cirgraphics | Cirgraphics Ltd. UK | Perform image transfer from photo-film to laminate PCB using UV light. |
| ....................................................................................................................................................................................................... | |||
| Plated Through Hole System (PTH) | Compcta L30 | Bungard, Germany | Perform Plated Through Hole on Printed Circuit Board (PCB) |
| ....................................................................................................................................................................................................... | |||
| Laminator | RLM 419P | Bungard, Germany | Laminate dry film to PCB (PCB track and Components Legend) for UV Exposure process and Chemical Etching process. |
| ....................................................................................................................................................................................................... | |||
| Reflow Oven | UM 500 | Mermert, Germany | Stabilize material properties (copper, fiber glass, etc) after Plated Through Hole Process or chemical etching. |
| ....................................................................................................................................................................................................... | |||
Photonic Devices
+ Auto Aligner + Digital Microscope + Bare Fiber Polisher + Labview Graphical Professional 7.0 + Temperature Chamber SWS-EMA testing + Wire Bonder + Differential Scanning Calorimeter (DSC) (Asset No:) Model: Perkin Elmer Diamond DSCEngineering Design Lab
Software
| Type | Model | Manufacturer |
| CADSTAR | Version 9 | Zuken, Japan |
| ....................................................................................................................................................................................................... | ||
| ALTIUM DESIGNER | Version 6.8 | Altium, UK |
| ....................................................................................................................................................................................................... | ||
| SOLIDWORKS | 2008 | Solidworks Corporation,US |
| ....................................................................................................................................................................................................... | ||
| PRO-ENGINEER | Wildfire | Parametric Technology Corporation,US |
| ....................................................................................................................................................................................................... | ||
Hardware
Electromagnetic Interference
+ EMC Pre-Compliance Tests + Measurement of RF Near-Field Electromagnetic Emission Using EMC Scanner + Computer Simulations - CDEGS Software + Impulse Impedance Test Measurements (Laboratory & Field) + Thermal Imager + Multi Channel Handheld Temperature Data Logger + Humidity & Temperature Data Logger + INDOOR AIR QUALITY MEASUREMENTLightning Protection & Power Quality
+ Lightning Protection System Audit + Lightning Protection System Design + Specialize Surge Testing + Lightning Measurement And Monitoring + Course And Seminar On Lightning Protection System + Evaluation Of Lightning Protection Specification + EARTH/GROUND TESTERList of Testing Services
- Type: Semiconductor Device Characterization
- Location: RF Test Laboratory TMRND-UKM
- Methods Available:
- On-wafer Technique
- On-packaged Technique
- On-board / Carrier Substrate Technique
- Test Capability:
- Low Frequency (DC) Parametric Measurement
- Resistance Measurement
- Capacitance Measurement
- Diode and Transistor Measurement
- Output Characteristic (Ids-Vds)
- Transfer Characteristic (Ids-Vgs)
- Transconductance (gm)
- Threshold Voltage (Vth)
- Breakdown Voltage (Vb)
- High Frequency (RF) Measurement
- Small-signal Analysis
- Passive Device (Inductor, Capacitor, Resistor, Filter, LTCC based)
- Active Device (Diode, Transistor)
- MMIC Device (LNA, PA, Switch)
- Noise Figure Analysis
- Amplifier
- Mixer
- Power and Spectrum Measurement (P1dB, OIP3)
- Load-Pull Measurement
+ HIGH PRECISION CV-IV MEASUREMENT SYSTEM + RF & MICROWAVE MEASUREMENT SYSTEM FROM DC - 40 GHz + LOAD-PULL MEASUREMENT SYSTEM FROM 0.8 - 18 GHz