Facilities > Engineering Design

Dry Film Laminator

Type

- Hardware

Description

-To laminate dry film to PCB (PCB track and Components Legend) for UV Exposure process and Chemical Etching process.

Specifications

- Max Lamination Width =400mm - Adjustable Lamination speed = 0.2 -1.2m / min - Adjustable Resist tension - Adjustable Lamination Pressure - Built-in heater (Programmable 20 -199 C)

Manpower

-