Facilities > Engineering Design

Multilayer Press

Type

- Hardware

Description

-To bond a multilayer structures for creating multilayer (4 to 6 layers) circuit boards in a laboratory of prototyping environment.

Specifications

Maximum layout area A3   Maximum press area A3   Maximum pressure 286 N/cm2   Maximum temperature 250 ºC (480 ºF)   Maximum number of layers 6   Microprocessor controlled 9 pressure/temperature/time profiles   Base material FR4

Manpower

-