IPv6
Enabled
About TMR&D Services Business Venture Contact Us TMR&D News Business Opportunities

Welcome to TM Research & Development

        You are using IPv4 from 38.103.63.61 Home | Sign In | Site Map | Procurement
Introduction Products Services Business News & Events Career Opportunities Contact Us
   Search TMRND.com  
   
 Services
Consultancy Services
Engineering Services
Testing Services
Contract Research
Training Services
Facilities
Facilities


PCB Fabrication

TMR&D Engineering Design (PCB Fabrication Department) consist of highly skilled full time Design & Fabrication to build and develop prototype and special projects. Our fully equipped facilities and highly trained, experienced staff can fabricate PCB from your drawings, PCB samples or GERBER data.

Item Capabilities
Single Sided Design & Fabricate Prototype
.......................................................................................................................................................................................................
Double Sided Design & Fabricate Prototype
.......................................................................................................................................................................................................
Surface Finishing Solder Flux coated (Clear gloss)
Mechanical miling surface
Chemical etching surface
.......................................................................................................................................................................................................
PCB Specification Min Track Width = 0.1mm (4mil)
Min gap = 0.1mm (4mil)
Min hole diameter = 0.2mm (8mil)
Resolution = 1 micron
Drilling hole = 90 holes/min
Plated-Through-Hole
Max Working area = A3 PCB Size
.......................................................................................................................................................................................................


Fabrication equipment
Type Model Manufacturer Functions
CNC Drill / Router ProtoMat H60 LPKF, Germany  
.......................................................................................................................................................................................................
Circuit Plotter ProtoMat H60 LPKF, Germany Perform drilling, routing and mechanical milling.
.......................................................................................................................................................................................................
Multilayer Press MultiPress II LPKF, Germany Fabricate Prototype (4-6 Layers 2nd Qtr 2006
.......................................................................................................................................................................................................
Spray Etcher Splash Center Bungard, Germany Perform chemical etching on PCB after UV Exposure process
.......................................................................................................................................................................................................
Ultra Violet (UV) exposure Cirgraphics Cirgraphics Ltd. UK Perform image transfer from photo-film to laminate PCB using UV light.
.......................................................................................................................................................................................................
Plated Through Hole System (PTH) Compcta L30 Bungard, Germany Perform Plated Through Hole on Printed Circuit Board (PCB)
.......................................................................................................................................................................................................
Laminator RLM 419P Bungard, Germany Laminate dry film to PCB (PCB track and Components Legend) for UV Exposure process and Chemical Etching process.
.......................................................................................................................................................................................................
Reflow Oven UM 500 Mermert, Germany Stabilize material properties (copper, fiber glass, etc) after Plated Through Hole Process or chemical etching.
.......................................................................................................................................................................................................


Engineering Design Lab

Software

Type Model Manufacturer
CADSTAR Version 9 Zuken, Japan
.......................................................................................................................................................................................................
ALTIUM DESIGNER Version 6.8 Altium, UK
.......................................................................................................................................................................................................
SOLIDWORKS 2008 Solidworks Corporation,US
.......................................................................................................................................................................................................
PRO-ENGINEER Wildfire Parametric Technology Corporation,US
.......................................................................................................................................................................................................



 

 

 

 

Hardware

+ Circuit Board Plotter
+ Plated Through Hole
+ Spray Etching
+ UV Exposure Unit
+ Dry Film Laminator
+ Oven
+ Multilayer Press
+ STRATASYS FDM VANTAGE i & ELMA WATERWORKS TANK S300 H ELMASONIC
+ Conveyorized Spray Etching Machine
+ Conveyorized Spray Developing Machine
+ PCB Brushing Machine
+ PCB Dryer Machine
+ PLC Nylon Vacuum Casting System

List of Testing Services

- Type: Semiconductor Device Characterization
- Location: RF Test Laboratory TMRND-UKM
- Methods Available:

  1. On-wafer Technique
  2. On-packaged Technique
  3. On-board / Carrier Substrate Technique

- Test Capability:

    • Low Frequency (DC) Parametric Measurement
    1. Resistance Measurement
    2. Capacitance Measurement
    3. Diode and Transistor Measurement
      1. Output Characteristic (Ids-Vds)
      2. Transfer Characteristic (Ids-Vgs)
      3. Transconductance (gm)
      4. Threshold Voltage (Vth)
      5. Breakdown Voltage (Vb)
    • High Frequency (RF) Measurement
      • Small-signal Analysis
      1. Passive Device (Inductor, Capacitor, Resistor, Filter, LTCC based)
      2. Active Device (Diode, Transistor)
      3. MMIC Device (LNA, PA, Switch)
      • Noise Figure Analysis
      1. Amplifier
      2. Mixer
      • Power and Spectrum Measurement (P1dB, OIP3)
      • Load-Pull Measurement


      + HIGH PRECISION CV-IV MEASUREMENT SYSTEM

      + RF & MICROWAVE MEASUREMENT SYSTEM FROM DC – 40 GHz

      + LOAD-PULL MEASUREMENT SYSTEM FROM 0.8 – 18 GHz

Contact our  Business Service Management for service enquiries.
 
©  2007, TM Research & Development. ALL RIGHTS RESERVED.
Best viewed with IE 6.x browser and above.